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- Information -2024.06.20Hot Disk Thermal Conductivity Measurement of Ceramic Substrates SiC, Al₂O₃, AlN
With advancements enabling smaller, lighter, and more functional products, heat accumulation challenges intensify. The adoption of thin, highly thermally conductive insulated cooling sheets is increasingly prevalent. Emphasizing the importance of thermal conductivity and coefficient of thermal expansion testing.
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- Information -2024.06.18Hot Disk 5G Hot Business Opportunity: Challenges by Cooling Technology
5G technology development is becoming increasingly mature. As bandwidth and speed increase, heating power also increases. The introduction of heat dissipation components and designs seems to be the biggest challenge in current heat dissipation technology, and it also brings the next wave of business opportunities for heat dissipation measurement technology.
